ʻO kāu mea hoʻolako uila alakaʻi a me nā mea hoʻolako Microcircuits
Aia ʻo Luoyang Zhongchao New Material Co., Ltd. (ma hope aku i kapa ʻia ʻo "ZC-TECH") ma Industrial Cluster Zone, Henan Province, Kina, e uhi ana i kahi ʻāpana ʻoi aku ma mua o 60 mau ʻeka. Hoʻokumu ʻia i ka makahiki 2003, he ʻoihana ia e hoʻohui i ka noiʻi ʻoihana a me ka hoʻomohala ʻana, ka hana ʻana, a me ke kūʻai ʻana i nā mea hou e pili ana i ke kaiapuni a me ka pollution -free. ʻO kāna mau huahana nui he aluminika ma muli o ka lapalapa maikaʻi loa -mea hoʻopaʻa ahi a me ka magnesium ma muli o ke ahi maikaʻi loa-mea hoʻopaʻa ʻia, alumina kūikawā, alumina pōʻai, boehmite, nā seramika kiʻekiʻe, nā seramika uila a me nā mea ʻokoʻa ʻē aʻe.
Hāʻawi i nā hoʻolālā hoʻohalahala maʻamau no nā koi kūikawā e like me ka hoʻopiha piha ʻana, ka uahi haʻahaʻa, a me nā noi manuahi -halogen.
Pono o Low Temperature Co-fired Ceramic
Loaʻa i nā mea ceramic nā alapine kiʻekiʻe maikaʻi loa, ka wikiwiki wikiwiki a me nā hiʻohiʻona ākea ākea. e like me nā mea like ʻole, hiki ke ʻokoʻa ka dielectric mau o nā mea ltcc i kahi ākea. I ka hui pū ʻana me ka hoʻohana ʻana i nā mea metala me ka conductivity kiʻekiʻe e like me ka mea conductor, pono ia e hoʻomaikaʻi i ka mea maikaʻi o ka ʻōnaehana kaapuni a hoʻonui i ka maʻalahi o ka hoʻolālā kaʻapuni.
Hiki iā ia ke hoʻololi i nā koi o ke kūpaʻa kiʻekiʻe o kēia manawa a me ke kiʻekiʻe wela, a ʻoi aku ka maikaʻi o ka thermal conductivity ma mua o ka papa subgrade pcb maʻamau, me ka hoʻonui nui ʻana i ka hoʻolālā wela o nā lako uila, hilinaʻi kiʻekiʻe, hiki ke hoʻopili ʻia i loko o kahi ʻano paʻakikī, hoʻonui i kona ola lawelawe;
Hiki ke hana ʻia ka papa haʻahaʻa uila me ka helu kiʻekiʻe o nā papa a hiki ke hoʻokomo ʻia nā ʻāpana passive he nui i loko, kahi e hoʻopau ai i ke kumukūʻai o nā mea hoʻopili. I loko o ka papa haʻahaʻa uila -ʻekolu me ka helu kiʻekiʻe o nā papa, hiki ke hoʻokō ʻia ka hoʻohui ʻana o nā ʻāpana passive a me nā mea hana, kahi e hoʻomaikaʻi ai i ka nui o ka hui o ke kaapuni a e hoʻemi hou i ka leo a me ke kaumaha.
Ua kūpono ia me nā ʻenehana hoʻolāleʻa multilayer ʻē aʻe, e like me ka ltcc i hui pū ʻia me ka ʻenehana -kiʻiʻoniʻoni ʻoniʻoni ʻoniʻoni e loaʻa ai ka nui o ka hui nui a me ka hana ʻoi aku ka maikaʻi o nā substrate multilayer hybrid a me nā ʻāpana multichip hybrid;
ʻO ka ʻenehana hana hoʻopau ʻana e hoʻomaʻamaʻa i ka nānā ʻana i ka maikaʻi o kēlā me kēia papa wiring a pili i loko o ka lua ma mua o ka hana ʻana o ka huahana i hoʻopau ʻia, kahi mea e pono ai ka hoʻomaikaʻi ʻana i ka hua a me ka maikaʻi o ka substrate multilayer, hoʻopōkole i ka pōʻai hana a hoʻemi i ke kumukūʻai.
Hoʻohana ʻia no ka Low Temperature Co-fired Ceramic
Kelepona:
Hoʻohana ʻia i nā modula RF a me nā antenna, hiki i ka LTCC ke hoʻouna i ka hōʻailona alapine kiʻekiʻe me ka liʻiliʻi o ka pohō, e hoʻomaikaʻi ana i ka maikaʻi kamaʻilio uea.
01
Aerospace & pale:
Hāʻawi i nā ʻāpana hilinaʻi a māmā no nā ʻōnaehana radar, kamaʻilio ukali, a me nā mea uila pūʻali koa e kū pono i nā kaiapuni paʻakikī.
02
Nā mea lapaʻau:
Hoʻomaʻamaʻa i nā mea hana kiʻi liʻiliʻi, nā mea implantable, a me nā mea hana diagnostic portable me nā uila i hoʻohui ʻia.
03
Kaʻa:
Powers advanced driver -assistance systems (ADAS), sensors, and in{1}}car communication modules, hoʻonui i ka palekana a me ka pilina.
04
Mea uila uila:
Kākoʻo i nā polokalamu akamai, nā mea hiki ke hoʻohana ʻia, a me nā mea IoT e koi ana i nā kaʻapuni alapine paʻa, -kiʻekiʻe.
05
ʻāpana huahana
|
'ikamu |
ʻIkepili ʻenehana |
|
Ma o ka Anawaena Hole |
0.2 mm, 0.15 mm |
|
Ka pololei o ke kūlana kuʻi |
±10 µm |
|
Hoʻopaʻa pololei |
±10 µm |
|
Pa'i ana i ka laula laina lahilahi |
75 µm |
|
Pono mānoanoa kiʻiʻoniʻoni |
±2 µm |
|
Paʻa Paʻa |
＞3 g(25 µm anawaena ʻula gula) |
|
Hoʻopili kiʻiʻoniʻoni |
＞0.5 kg/mm2 |
|
Ka helu o na papa |
5 ~ 30 papa |
Nā Pōmaikaʻi o ka ʻenehana kaapuni kiʻiʻoniʻoni lahilahi
Hoʻonui liʻiliʻi:
Hiki i ka ʻenehana kiʻiʻoniʻoni lahilahi ke hana i nā kaʻapuni paʻa loa, i kūpono ia no nā noi i kaupalena ʻia ka wahi.
Alapine kiʻekiʻe:
Hōʻike nā kiʻi ʻoniʻoni lahilahi i ka hana maikaʻi ma nā alapine kiʻekiʻe, e kūpono ana ia mau mea no nā noi ma RF a me nā ʻōnaehana microwave.
Hana kiʻekiʻe:
ʻO ka hoʻohana ʻana i -mea kiʻekiʻe a me nā kaʻina hana pololei e loaʻa i nā kaapuni me nā hiʻohiʻona hana maikaʻi loa.
Haʻahaʻa mana hoʻohana:
He haʻahaʻa ka mana o ka mana kiʻiʻoniʻoni lahilahi-hoʻohālikelike i nā ʻenehana kaapuni ʻē aʻe.
Pono:
ʻO ke kaʻina hana kiʻiʻoniʻoni lahilahi e hōʻoia i ka hoʻopili maikaʻi ʻana a me ka paʻa o nā mea, e alakaʻi ana i ka hilinaʻi maikaʻi a me ka lōʻihi o nā kaapuni.
Noi o ka Thin Film Circuit Technology
Optoelectronics a me nā hōʻike:
Hiki i nā ʻili kiʻiʻoniʻoni lahilahi ke hana i nā ʻāpana hoʻoheheʻe akaka, nā -pani hoʻoulaula, a me nā ʻāpana hoʻoheheʻe māmā, e hoʻonui ai i ka hana a me ka maikaʻi ʻike o nā mea optoelectronic.
Nā Semiconductor a me nā kaapuni i hoʻohui ʻia:
He hana koʻikoʻi ka ʻenehana kiʻiʻoniʻoni lahilahi i ka hana ʻana i nā semiconductor a me nā kaʻapuni hoʻohui ʻia (ICs). Hiki iā ia ke waiho i nā ʻāpana lahilahi o nā mea, e like me ka silicon dioxide (SiO2) a i ʻole silicon nitride (Si3N4), ma ke ʻano he insulating layers a i ʻole dielectrics gate. Hoʻomaʻamaʻa nā kiʻiʻoniʻoni lahilahi i ka hana ʻana i nā ala conductive, interconnects, a me nā papa metalization i nā kaʻina hana IC.
Optics a me Photonics:
Hoʻohana nui ʻia nā kiʻiʻoniʻoni lahilahi i nā ʻāpana optical a me nā ʻōnaehana. Hāʻawi lākou i ka hana ʻana i nā ʻāpana anti-reflective ma nā lens a me nā aniani e hōʻemi i ka noʻonoʻo māmā a hoʻonui i ka lawe ʻana i ka māmā.
Nā mea ʻike a me nā biosensors:
Loaʻa ka ʻenehana kiʻiʻoniʻoni lahilahi i nā noi no ka hoʻomohala ʻana i nā mea ʻike a me nā biosensors no nā ʻoihana ākea. Hiki ke hoʻohana ʻia nā kiʻiʻoniʻoni lahilahi no ka hana ʻana i nā ʻāpana koʻikoʻi e pili ana me nā analytes target a i ʻole nā kūlana kaiapuni, e hiki ai ke ʻike i nā ʻāpana kino, kemika, a i ʻole ke olaola.
Ka mālama ʻana i ka ikehu a me ka hoʻololi ʻana:
He kuleana koʻikoʻi nā kiʻiʻoniʻoni lahilahi i ka mālama ʻana i ka ikehu a me nā ʻenehana hoʻololi. I loko o nā ʻeke a me nā wahie, hoʻohana ʻia nā kiʻiʻoniʻoni lahilahi e like me nā pale pale, nā mea hoʻokaʻawale, a me nā papa catalyst e hoʻomaikaʻi i ka hana, ka lōʻihi, a me ka pono. ʻO nā kiʻiʻoniʻoni ʻoniʻoni ʻoniʻoni ʻoniʻoni, e like me nā kiʻiʻoniʻoni kiʻi ʻoniʻoni ʻoniʻoni (TFPV) ma muli o nā mea e like me ke silikoni amorphous (a-Si) a i ʻole cadmium telluride (CdTe), e hāʻawi i kahi ʻokoʻa i nā kilikaki kuʻuna -pūnaewele lā.
Pūnaehana Microelectromechanical (MEMS):
ʻO ka ʻenehana kiʻiʻoniʻoni lahilahi -mea hoʻohui i ka hana ʻana i nā polokalamu MEMS. Hoʻohana ʻia nā kiʻiʻoniʻoni lahilahi e hana i nā papa hana, nā mea piezoelectric, a me nā ʻāpana conductive i ka hana ʻana i ka MEMS, e ʻae ai i ka mana pololei a me ka hoʻoponopono ʻana i nā hanana kino ma ka microscale.
ʻāpana huahana
|
'ikamu |
ʻIkepili ʻenehana |
|
Ma o Hole |
Mānoanoa o ka lepo×0.8 |
|
Ka mamao iki mai ka Alakaʻi i ka Band i ka lihi o ka Ceramic |
0.050 mm |
|
Lithographic Ka Laina Li'ili'i Loa |
0.015mm |
|
Kūʻē |
±10% |
Palapala
fAQ
Ua kaulana mākou-ʻo kekahi o nā mea uila a me nā mea hana microcircuits a me nā mea hoʻolako ma Kina. E ʻoluʻolu e kūʻai i nā mea uila kiʻekiʻe a me nā microcircuits i hana ʻia ma Kina ma ʻaneʻi mai kā mākou hale hana. No ke kūkākūkā kumukūʻai, e kelepona mai iā mākou.